Phone: 
520.621.6101
Professor
Email: 
ara@email.arizona.edu

Biography

Dr. Philipossian has been a professor of Chemical Engineering at the University of Arizona since 2001 where he holds the Koshiyama Chair of Planarization. Since its establishment in 2004, he has also been the Co-Founder, President and CEO of Araca, Inc., the premier provider of services and equipment to the polishing and planarization industry worldwide (www.aracainc.com).

He received his BS, MS and PhD in Chemical Engineering from Tufts University in 1983, 1985 and 1992, respectively.

From 1992 to 2001, he was the Materials Technology Manager at Intel Corp. (Santa Clara, CA USA) responsible for development, characterization, implementation and sustaining of new and existing CMP and post-CMP cleaning consumables, low k dielectrics and electroplating chemicals. From 1986 to 1992, he worked at Digital Equipment Corporation (Hudson, MA USA) as a process development manager focusing on thermal silicon oxidation, diffusion, LPCVD of dielectric and gate electrodes, and wafer cleaning technology.

Dr. Philipossian has authored approximately 125 archival journal publications and about 170 articles in conference proceedings. He holds 25 patents in the area of semiconductor processing and device fabrication with another 20 patents pending.

 Research

Fluid mechanics of planarization processes and post-planarization cleaning processes used in integrated circuit (IC) manufacturing. Study of the environmental aspects of planarization processes with focus on slurry, pad, water and chemical use reduction along with tribological, kinetic and thermal analysis (as well as modeling) of the processes.

Publications (2010 to present)

1.     Effect of Pad Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process. X. Liao, Y. Zhuang, L. Borucki, J. Cheng, S. Theng, T. Ashizawa and A. Philipossian. Japanese Journal of Applied Physics, 52, 018001 (2013).

2.     Aggressive Diamond Wear Characterization and Analysis during Chemical Mechanical Planarization. C. Wu, Y. Zhuang, X. Liao, Y. Jiao, Y. Sampurno, S. Theng, F. Sun, A. Naman and A. Philipossian. ECS Journal of Solid State Science and Technology, 2(1), P36-P41 (2013).

 3.     Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization. Y. Jiao, Y. Zhuang, X. Wei, Y. Sampurno, A. Meled, S. Theng, J. Cheng, D. Hooper, M. Moinpour and A. Philipossian. Journal of Solid State Science and Technology, 1(5), N103-N105 (2012).

4.     Investigation of Eccentric PVA Brush Behaviors in Post-Cu CMP Scrubbing. T. Sun, Y. Zhuang, W. Li and A. Philipossian. Microelectronic Engineering, 100, 20-24 (2012).

5.     Effect of Retaining Ring Slot Designs and Polishing Conditions on Slurry Flow Dynamics at Bow Wave. X. Liao, Y. Sampurno, Y. Zhuang, A. Rice, F. Sudargho, A. Philipossian and C. Wargo. Microelectronic Engineering, 98, 70-73 (2012).

6.     Effect of Temperature on Pad Surface Contact Area in Chemical Mechanical Planarization. Y. Jiao, Y. Zhuang, X. Liao, L. Borucki, A. Naman and A. Philipossian. Electrochemical and Solid-State Letters, 1(2), N13-N15 (2012).

7.     Effect of Slurry Application/Injection Schemes on Slurry Availability during Chemical Mechanical Planarization (CMP). X. Liao, Y. Sampurno, Y. Zhuang and A. Philipossian. Electrochemical and Solid-State Letters, 15 (4), H118-H122 (2012).

8.     Effect of Concentric Slanted Groove Patterns on Slurry Flow during Chemical Mechanical Planarization. D. Rosales-Yeomans, H. Lee, T. Suzuki and A. Philipossian. Thin Solid Films, accepted for publication.Thin Solid Films, 520, 2224–2232 (2012).

9.     Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes. Y. Jiao, X. Liao, C. Wu, S. Theng, Y. Zhuang, Y. Sampurno, M. Goldstein and A. Philipossian. Journal of Electrochemical Society, 159(3), H255-H259 (2012).

10. An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization. Y. Sampurno, A. Rice, Y. Zhuang and A. Philipossian. Electrochemical and Solid-State Letters, 14(8), H318-H321 (2011). 

11. Analysis of a Novel Slurry Injection System in Chemical Mechanical Planarization. A. Meled, Y. Zhuang, Y. Sampurno, S. Theng, Y. Jiao, L. Borucki and A. Philipossian. Japanese Journal of Applied Physics, 50, 05EC01 (2011).

12. Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process. Y. Jiao, Y. Sampurno, Y, Zhuang, X. Wei, A. Meled and A. Philipossian. Japanese Journal of Applied Physics, 50, 05EC02 (2011).

13. Pattern Evolution in Shallow Trench Isolation Chemical Mechanical Planarization via Real-Time Shear and Down Forces Spectral Analyses. Y. Sampurno, F. Sudargho, Y. Zhuang, T. Ashizawa, H. Morishima and Ara Philipossian. Microelectronic Engineering, 88(9), 2857-2861 (2011).

14. Effect of Pad Micro-Texture on Frictional Force and Removal Rate during Copper CMP Process. X. Liao, Y. Zhuang, L. Borucki, S. Theng, T. Ashizawa and A. Philipossian. Electrochemical and Solid-State Letters, 14(5), H201-H204 (2011).

15. Investigation of Pad Staining and Its Effect on Removal Rate in Copper Chemical Mechanical Planarization. H. Lee, Y. Zhuang, L. Borucki, S. Joh, F. O’Moore and A. Philipossian. Thin Solid Films, 519(1), 259-264 (2010).

16. Novel Diamond Disc Diagnostic Method Based on ‘Dry’ Coefficient of Friction Measurements. A. Meled, Y. Sampurno, F. Sudargho, Y. Zhuang and A. Philipossian. Electrochemical and Solid-State Letters, 13(12), H457-H459 (2010).

17. Tribological, Thermal and Wear Characteristics of Polyphenylen Sulfied and Polyetheretherketone Retaining Rings in Inter-Layer Dielectric CMP. X. Wei, Y. Zhuang, Y. Sampurno, F. Sudargho, C. Wargo, L. Borucki and A. Philipossian. Electrochemical and Solid-State Letters (2010), 13(11), H391-H395.

18. Characterization of Pad-Wafer Contact in CMP Using Confocal Microscopy. T. Sun, Y. Zhuang, L. Borucki and A. Philipossian. Japanese Journal of Applied Physics, 49(6), 066501 (2010).

19. End-Point Detection of Ta/TaN Chemical Mechanical Planarization via Forces Analysis. Y. Sampurno, X. Gu, T. Nemoto, Y. Zhuang, A. Teramoto, A. Philipossian and T. Ohmi. Japanese Journal of Applied Physics, 49, 05FC01 (2010).

20. Optical and Mechanical Characterization of Chemical Mechanical Planarization of Pad Surfaces. T. Sun, Y. Zhuang, L. Borucki and A. Philipossian. Japanese Journal of Applied Physics, 49(4), 046501 (2010).

21. Investigating the Effect of Conditioner Aggressiveness on Removal Rate during Inter-Layer Dielectric CMP through Confocal Microscopy and Dual Emission UV Enhanced Fluorescence Imaging. T. Sun, L. Borucki, Y. Zhuang, Y. Sampurno, F. Sudargho, X. Wei, S. Anjur and A. Philipossian. Japanese Journal of Applied Physics, 49(2), 026501 (2010).

22. A Three-Step Copper CMP Model Including the Dissolution Effects of a Commercial Slurry Dissolution. D. DeNardis, D. Rosales-Yeomans, L. Borucki and A. Philipossian. Thin Solid Films, 518, 3910-3916 (2010).

23. Studying the Effect of Temperature on the Copper Oxidation Process Using Hydrogen Peroxide for Use in Multi-Step CMP Models. D. DeNardis, D. Rosales-Yeomans, L. Borucki and A. Philipossian. Thin Solid Films, 518, 3903-3909 (2010).

24. Effect of Retaining Ring Slot Design on Slurry Film Thickness during CMP. X. Wei, Y. Sampurno, Y. Zhuang, R. Dittler, A. Meled, J. Cheng, C. Wargo, R. Stankowski and A. Philipossian. Electrochemical and Solid-State Letters, 13(4), H119-H121 (2010).

25. Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography. T. Sun, L. Borucki, Y. Zhuang and A. Philipossian. Microelectronic Engineering, 87, 553-559 (2010).

26. Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process. A. Meled, Y. Zhuang, X. Wei, J. Cheng, Y. Sampurno, L. Borucki, M. Moinpour, D. Hooper and A. Philipossian. Journal of Electrochemical Society, 157(3), H250-H255 (2010).

27. Slurry-Induced Pad Wear Rate in Chemical Mechanical Planarization. A. Meled, Y. Sampurno, Y. Zhuang and A. Philipossian. Electrochemical and Solid-State Letters, 13 (3), H52-H54 (2010).

Faculty

University of Arizona College of Engineering